com.hipay.payments:core — package for hipay-payments-sdk-kmp KMP library

core:1.1.0

Latest release1.1.0 (11 days ago)

Parent projecthipay-payments-sdk-kmp (0 stars)

Kotlin version2.2.20

LicenseApache-2.0

DeveloperHiPay

Build tool versionGradle 8.14.3

Android

1.8

iOS

ios_arm64ios_simulator_arm64

implementation("com.hipay.payments:core:1.1.0")

core

Headless core of the HiPay payment SDK for Kotlin Multiplatform: configuration, gateway client, card tokenization and the shared validation contract. Targets the HiPay Fullservice platform.

Homepage

Source code management

Maven artifacts

Version	Release	Platforms
1.1.0	Release: 28 Aug 2026	iOSAndroid
1.0.0	Release: 11 Aug 2026	iOSAndroid

*Only more recent versions are displayed

Android

1.8

iOS

ios_arm64ios_simulator_arm64

Version	Release	Platforms
1.1.0	Release: 28 Aug 2026	iOSAndroid
1.0.0	Release: 11 Aug 2026	iOSAndroid

*Only more recent versions are displayed